Inside TSMC’s Arizona Fab: Rare Glimpse of Advanced Chip Manufacturing Process
TSMC has unveiled a rare behind-the-scenes look at its Arizona fabrication facility, showcasing advanced EUV lithography systems and automated wafer transport. The video reveals sophisticated manufacturing processes capable of producing 5nm and 4nm class chips for major tech companies. Industry analysts suggest the facility is approaching its full production capacity of approximately 24,000 wafers monthly.
Unprecedented Access to Advanced Chip Manufacturing
Taiwan Semiconductor Manufacturing Company (TSMC) has provided a rare video glimpse inside its Fab 21 facility in Arizona, offering unprecedented visibility into the sophisticated processes behind cutting-edge semiconductor production. According to reports, the video showcases the company’s advanced clean room operations and extreme ultraviolet (EUV) lithography systems that produce chips for major technology firms including Apple, AMD, and Nvidia.